Cryofuze Heat Sink Compound

Cooler Master CryoFuze 7, MPN MGZ-NDSG-N07M-R2, is a 2 g thermal paste for transferring heat from processing components. Its role is to form a thermal interface between a component and its cooler.

The compound is gray and has a listed thermal impedance of 0.03 °C·in²/W. Cooler Master describes the formula as non-corrosive and stable across a temperature range of −50 °C to 250 °C.

The manufacturer says its balanced consistency supports straightforward application and cleanup. This compact quantity is suited to thermal paste work where a small amount of compound is needed.